Amardeep Steel is a leading supplier of high-quality Tantalum Sputtering Targets made from very pure tantalum. This ensures a consistent and reliable material. The high density of tantalum improves sputtering efficiency and helps films stick better. Tantalum also has excellent thermal stability, allowing the targets to handle extreme heat during the sputtering process, making them suitable for high-temperature applications. Its strong corrosion resistance ensures that the targets remain intact even in tough conditions. The low levels of impurities and gas in the tantalum lead to better film quality and uniformity.
Additionally, tantalum is easy to machine, allowing for precise shaping to meet specific needs. Because of these outstanding properties, Tantalum Sputtering Targets are widely used for depositing tantalum films in industries like electronics, optics, thin-film solar energy, and magnetic storage, making them essential for many sputtering processes.
Tantalum Sputtering Targets come in 8 variations, offering various sizes and orientations to fit different sputtering system setups. These high-purity tantalum discs are perfect for thin film deposition in applications like semiconductor device fabrication, optical coatings, and material surface modification. Tantalum's high melting point, good electrical conductivity, and chemical inertness make it a versatile choice for both research and industrial uses.
Discover our premium tantalum products, including pipes, tubes, flanges, and fittings, known for their exceptional durability and corrosion resistance.
| Part No. | Material | Size | Purity |
|---|---|---|---|
| TA0201 | Tantalum | 1.00" Dia. x 0.125" Thick | 99.95% |
| TA0202 | Tantalum | 1.00" Dia. x 0.250" Thick | 99.95% |
| TA0203 | Tantalum | 2.00" Dia. x 0.125" Thick | 99.95% |
| TA0204 | Tantalum | 2.00" Dia. x 0.250" Thick | 99.95% |
| TA0205 | Tantalum | 3.00" Dia. x 0.250" Thick | 99.95% |
| TA0206 | Tantalum | 3.00" Dia. x 0.250" Thick | 99.95% |
| TA0207 | Tantalum | 4.00" Dia. x 0.250" Thick | 99.95% |
| TA0208 | Tantalum | 4.00" Dia. x 0.250" Thick | 99.95% |
| TA0209 | Tantalum | 5.00" Dia. x 0.250" Thick | 99.95% |
| TA0210 | Tantalum | 5.00" Dia. x 0.250" Thick | 99.95% |
| Element | R05200 (%,Max) | R05400 (%,Max) |
|---|---|---|
| C | 0.01 | 0.01 |
| O | 0.015 | 0.03 |
| N | 0.01 | 0.01 |
| H | 0.0015 | 0.0015 |
| Fe | 0.01 | 0.01 |
| Mo | 0.02 | 0.02 |
| Nb | 0.1 | 0.1 |
| Ni | 0.01 | 0.01 |
| Si | 0.005 | 0.005 |
| Ti | 0.01 | 0.01 |
| W | 0.05 | 0.05 |
| Molecular Weight | 180.94 |
|---|---|
| Appearance | Silvery-gray solid |
| Melting Point | 3017 °C |
| Boiling Point | 5458 °C |
| Density | 16.69 g/cm3 (20 °C) |
| Solubility in H2O | N/A |
| Crystal Phase / Structure | α: body-centered cubic (bcc) / β: tetragonal |
| Electrical Resistivity | 131 nΩ·m (20 °C) |
| Electronegativity | 1.5 Paulings |
| Heat of Fusion | 36.57 kJ/mol |
| Heat of Vaporization | 753 kJ/mol |
| Poisson's Ratio | 0.34 |
| Specific Heat | 140 J/kg·K |
| Thermal Conductivity | 57.5 W/m·K |
| Thermal Expansion | 6.3 µm/m·K |
| Vickers Hardness | 870–1200 MPa |
| Young's Modulus | 186 GPa |
The Tantalum sputtering process involves depositing Tantalum thin films onto a substrate, typically maintained at a temperature of about 50-200°C. The base pressure during this process is usually around 10^-8 Torr, with the argon (Ar) background gas maintained at levels between 0.2 and 10 mTorr. The sputtering power applied generally ranges from 0.1 to 10 watts per square centimeter. Sputtering targets are made from a variety of materials, including high-purity metals, alloys, and different types of ceramics. Common materials include metal and alloy targets, as well as ceramics such as oxides, nitrides, carbides, fluorides, silicides, sulfides, borides, selenides, tellurides, antimonides, and arsenides. Each material offers unique properties for specific applications. Sputtering is a physical vapor deposition (PVD) technique used to deposit thin films. In this process, material is ejected from a target and then deposited onto a substrate. Magnetron sputtering enhances this method by using a magnetic field around the target, which energizes argon atoms that bombard the target, improving the efficiency of material deposition. The sputtering target is the source material used to deposit functional films onto a substrate under specific conditions. These targets are widely employed in various industries, including decoration, tooling, glass production, electronics, semiconductors, and solar cells, making them vital for advanced coatings and materials. Cairo, Kanpur, Kuala Lumpur, Perth, Vung Tau, Jamshedpur, Milan, Chiyoda, Algiers, Bengaluru, London, Visakhapatnam, Ernakulam, Los Angeles, Bogota, Jeddah, Sharjah, Dallas, Courbevoie, Petaling Jaya, Thiruvananthapuram, Al Jubail, Gurgaon, Ankara, Seoul, Lahore, Toronto, Faridabad, Singapore, Chennai, Navi Mumbai, Haryana, Sydney, Colombo, Mexico City, Ulsan, Secunderabad, Busan, Lagos, Pune, Jaipur, Muscat, Kolkata, Geoje-si, Dammam, Aberdeen, Thane, Bangkok, Abu Dhabi, Bhopal, Kuwait City, La Victoria, Noida, Port-of-Spain, Moscow, Hyderabad, Nashik, Granada, Karachi, Indore, Manama, Atyrau, Tehran, Houston, Coimbatore, Dubai, Calgary, Montreal, Rio de Janeiro, Riyadh, Gimhae-si, Ludhiana, Santiago, Melbourne, Ahmedabad, New York, Ahvaz, New Delhi, Jakarta, Ho Chi Minh City, Al Khobar, Doha, Edmonton, Surat, Hong Kong, Hanoi, Howrah, Ranchi, Baroda, Brisbane, Chandigarh, Istanbul, Nagpur, Rajkot, Caracas, Vadodara, Madrid, Pimpri-Chinchwad, Mumbai. Norway, Nigeria, Namibia, Bangladesh, Israel, Gambia, Morocco, United Arab Emirates, Hungary, Turkey, Lithuania, Indonesia, Bhutan, Yemen, Trinidad & Tobago, Tunisia, Lebanon, Iran, Russia, Czech Republic, Taiwan, Japan, Australia, Nepal, Zimbabwe, Canada, Mexico, Qatar, South Korea, Belgium, Argentina, Ecuador, France, Finland, United Kingdom, Kuwait, Peru, Germany, Colombia, Estonia, Thailand, Singapore, Mongolia, Austria, Poland, Malaysia, China, Philippines, India, Hong Kong, Chile, Iran, Macau, Bolivia, Romania, Ghana, Poland, Vietnam, South Africa, Mexico, Sri Lanka, New Zealand, Kazakhstan, Bahrain, Ukraine, United States, Egypt, Oman, Afghanistan, Libya, Chile, Ireland, Serbia, Angola, Croatia, Jordan, Spain, Brazil, Sweden, Tibet, Saudi Arabia, Bulgaria, Azerbaijan, Italy, Costa Rica, Switzerland, Algeria, Portugal, Nigeria, Gabon, Puerto Rico, Slovakia, Greece, Pakistan, Iraq, Kenya, Venezuela, Belarus, Denmark.Tantalum Sputtering Target Applications
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